The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Dec. 18, 1998
Koushik Banerjee, Chandler, AZ (US);
Intle Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit package which has a staggered bond wire pattern that increases the bond finger width to pad pitch ratio of the package. The package includes a first bond shelf, a second bond shelf and a third bond shelf. Mounted to the package is an integrated circuit which has a plurality of die pads. The die pads are arranged in a pattern of groups, wherein each group has a first die pad that is adjacent to a second die pad, and a third die pad that is adjacent to the second die pad and a first die pad of an adjacent group. Bond wires connect the first die pads to the first bond shelf, the second die pads to the second bond shelf and the third die pads to the third bond shelf, so that each adjacent die pad is connected to a different bond shelf. The staggered bond pattern maximizes the bond finger width of the package.