The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Mar. 10, 2000
Kevin A. McCullough, Warwick, RI (US);
Chip Coolers, Inc., Warwick, RI (US);
Abstract
A method of molding a reinforced article for optimizing heat transfer, electrical conductivity and/or structural integrity is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The desired positioning of the filler within the molded article is determined according to the thermal, electrical or structural needs of the article. An input gate and output gate vent is formed in the mold assembly to ensure positioning of the filler as desired. Polymer, loaded with reinforced filler, is introduced into the mold assembly via the input gate. Polymer is positioned in the mold assembly with the reinforcing filler being substantially parallel and aligned with the flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal and electrical conductivity and structural integrity of articles may be increased several times over articles molding with conventional molding methods.