The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Jun. 21, 1999
Applicant:
Inventors:
Eiji Takano, Yokohama, JP;
Shinya Shimizu, Oita, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 ;
U.S. Cl.
CPC ...
H05K 3/30 ;
Abstract
One-side ends of fine metal wires are bonded onto pads of a semiconductor chip via wire bonding and the other ends of the fine metal wires are mounted on the board by flip chip.
Takano, Eiji. (2001). Semiconductor device mounted on board by flip-chip and method for mounting the same (U.S. Patent No. 6214156). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6214156
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile