The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2001

Filed:

Aug. 09, 1999
Applicant:
Inventors:

Atsushi Tanaka, Toyama, JP;

Yoshimitsu Motoki, Toyama, JP;

Satoshi Nakao, Toyama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/12 ; H01G 7/00 ;
U.S. Cl.
CPC ...
G01L 9/12 ; H01G 7/00 ;
Abstract

A capacitance-type pressure sensor unit capable of being assembled without applying a pressure at an increased level to a circuit board. A connector body (,) has a base (,) received in a peripheral wall section (,) of a receiving casing (,) constituting a main body of the casing (,) and fixed to an end (,) of the peripheral wall section (,) by caulking. A pressure sensor element (,) constituted of a first insulating substrate (,) and a second insulating substrate (,) is arranged in a bottom wall section (,) of the receiving casing (,) and a fluid chamber (,) into which pressure measured fluid is introduced is defined between a rear surface of the first insulating substrate (,) and the bottom wall section (,). A circuit board (,) received in a circuit component receiving chamber (,) defined in the base (,) of the connector body (,) is supported by connection conductors (,) for connection of a connector (,), metal terminal fitments (,) for electrically connecting output electrodes (,) of the pressure sensor element (,) to a circuit board (,) and a ground terminal fitment (,) for electrically connecting a ground electrode of the circuit board (,) to the receiving casing (,) while being suspended in the chamber (,).


Find Patent Forward Citations

Loading…