The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2001
Filed:
Sep. 02, 1998
Applicant:
Inventor:
Hiroshi Honmou, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/00 ;
U.S. Cl.
CPC ...
H01S 5/00 ;
Abstract
An electrode of a laser diode (LD) is joined with a Si substrate via a solder layer. A cavity region is formed directly under the LD in the solder layer. The solder layer spreads outside the cavity region. Since there arises no stress in a space of the cavity region, the internal stress of the active layer, which is formed directly over the cavity region, is relaxed as compared with that in a conventional optical module, which is provided with no cavity region in the solder layer. Accordingly, a highly reliable optical module can be obtained.