The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2001

Filed:

Oct. 18, 1999
Applicant:
Inventor:

Akio Yamaguchi, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

An automatically mountable heat sink for effectively conducting and dissipating heat of an electronic part comprises a heat dissipation plate formed by bending a rectangular metal plate of aluminum, copper or the like by means of pressing along the lines perpendicular to its longitudinal direction and a phase changing member made of a mixture of paraffin and epoxy resin having alumina as a heat conductive filler dispersed therein and applied to a ceiling surface of the heat dissipation plate. When the heat sink and the electronic parts are soldered on a printed wiring board by heating of reflow soldering, the phase changing member made of the mixture of paraffin and epoxy resin is softened and partly moves downward by the action of gravity to abut the upper surface of the electronic part, then is solidified, thereby connecting the heat dissipation plate and the electronic part with each other.


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