The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2001
Filed:
Aug. 18, 1999
Applicant:
Inventor:
Alan W Hansford, Austin, TX (US);
Assignee:
Sigmatel Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
An integrated circuit having a unique identifying module includes a first and second bonding pads that are deposited on a die. The identifying module further includes a bond determining module that is operably coupled to the first and second bonding pads. As coupled, the bond determining module determines the bonding status of the first and second bonding pads. For example, the bonding status indicates whether a packaged pin is bonded to the first bonding pad, the second bonding pad, both bonding pads or neither bonding pad. Based on the bonding status, the bond determining module produces a die identifier which uniquely identifies the integrated circuit.