The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2001

Filed:

Dec. 18, 1997
Applicant:
Inventor:

Toshimichi Taguchi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 ;
U.S. Cl.
CPC ...
H05K 1/02 ;
Abstract

A printed-circuit substrate is described. A film-shaped support base having an electrical insulating property and elasticity is provided with a resin mold section for supporting an integrated circuit. A plurality of foil-shaped electric conductors are connected to the integrated circuit at their base side and are supported by the support base so as to extend toward the periphery of the support base at their tip side. The conductors are formed on a first surface of the support base and the first base faces electrodes of an external device. Exposed portions are provided by removing the support base in an intersecting direction of the foil-shaped electric conductors over an entire area of the support base between the integrated circuit and the periphery thereof, so that one portion of each foil-shaped electric conductor is exposed by separating the main support base supporting the integrated circuit and the periphery thereof. Supporting exposed portions, located on both sides of a set of the exposed portions in a direction orthogonal to the exposed portions, each have a width wider than that of each exposed portion.


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