The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2001
Filed:
Jun. 23, 1999
Sang Wook Park, Kyoungki-do, KR;
Ji Yon Kim, Kyoungki-do, KR;
Hyundai Electronics Industries Co., Ltd., Kyoungki-do, KR;
Abstract
A chip size package is disclosed herein, as well as a method for fabricating the same. A recess is formed in a surface of semiconductor chip. Bonding pads are formed on a bottom center of the recess and insulating pads,are formed on both lateral sides of the recess. The respective pads are connected to each other with metal wires. An epoxy compound is filled in the recess. Herein, midway portions of the metal wires are exposed from the epoxy compound. Bumps are formed on the midway portions of the metal wires being exposed from the epoxy compound and solder balls are mounted on the bumps. Therefore, the epoxy compound is not protruded from the semiconductor chip, thickness of the package is equal to that of the semiconductor chip. The thickness of package is minimized.