The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2001
Filed:
Oct. 02, 1998
Tatsuo Kawata, Shimodate, JP;
Hiroki Sashima, Shimodate, JP;
Takaki Kashihara, Shimodate, JP;
Masanobu Fujii, Shimodate, JP;
Naoki Nara, Mito, JP;
Terumi Tsukahara, Shimodate, JP;
Hiroyuki Sakai, Shimodate, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.