The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2001
Filed:
Sep. 21, 1999
Kazuhito Hosokawa, Osaka, JP;
Masahiro Oura, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A thermosetting pressure-sensitive adhesive which can obtain the high rate of polymerization without a decrease in the molecular weight by photopolymerization, thereby show the tackiness at ordinary temperatures to permit easy temporary adhesion to an adherend, can be cured by heating for a short period of time to exhibit strong adhesive strength and high heat resistance, and is excellent in storage stability before heating, comprising a photopolymerized product of a composition comprising a) 100 parts by weight of a monomer mixture comprising 70% to 99% by weight of an alkyl (meth)acrylate whose alkyl group has 2 to 14 carbon atoms on average, and 1% to 30% by weight of a monoethylenic unsaturated acid copolymerizable therewith based on the monomer mixture, b) 0.01 part to 20 parts by weight of a cleavage type photopolymerization initiator having 3 or more peroxide groups in its one molecule, c) 5 parts to 30 parts by weight of an epoxy resin, and not substantially containing a curing agent for the epoxy resin as ingredient (c).