The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2001
Filed:
Feb. 28, 2000
Agency of Industrial Science and Technology, Tokyo, JP;
Abstract
The present invention relates to a large deformation apparatus for metal-based materials that comprises a mold (A), a support mechanism (B) for supporting the mold (A), and a rotary mechanism (C) for rotating the mold (A), wherein the mold (A) comprises a mold body (,), four holes (,) that pass through the mold body (,) and intersect in its interior, and engagement means (3,) for engaging the rotary mechanism (C), each hole (,) being provided with a punch (,) that can slide or otherwise move with friction in relation to the hole (,) and that extends from the end face of the mold body (,) to the intersection of the holes (,); the support mechanism (B) comprises restraint plates (6,), (6,), and (6,) for restraining the external end faces of the mold body (,) having holes (,), and holding plates (7,) and (7,) for holding the mold body (,); and the rotary mechanism (C) comprises engagement means (3,) for engaging the engagement means (3,), rotary means (,), connection means (,) for connecting the engagement means (3,) and the rotary means (,), and to a method for applying large deformation to a metal-based material with the aid of the apparatus, and further to a metal-based material subjected to large deformation by the method.