The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2001

Filed:

Jul. 23, 1999
Applicant:
Inventors:

Curtis M. Griffin, Boca Raton, FL (US);

Jeffrey A. Rollman, Boca Raton, FL (US);

Edmund B. Boucher, Ft. Lauderdale, FL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 ;
U.S. Cl.
CPC ...
H05K 1/14 ;
Abstract

A multiple substrate mounting frame (,) includes first (,) and second (,) surfaces and a plurality of windows or cavities (,). A set of substrates having electrical circuitry (,) are attached and electrically connected to the first surface (,) of the mounting frame (,). The second surface (,) can then be electrically interconnected to a mother board (,). A leadless surface mountable assembly for multiple die (,) includes the mounting frame (,) which receives a plurality of substrates (,) and electrically interconnects them to each other and/or to a mother board (,). A heat sink (,) can be provided if the die (,) generate too much heat.


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