The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Nov. 10, 1999
Kiyohumi Yamamoto, Minamiashigara, JP;
Hiroshi Maeda, Minamiashigara, JP;
Satoshi Mino, Minamiashigara, JP;
Kazuhiro Nishida, Minamiashigara, JP;
Fuji Photo Film Co., Ltd., Kanagawa-Ken, JP;
Abstract
A bonding apparatus has a probe for causing an LED chip to emit light before the LED chip is bonded on a board, an imaging system for recognizing the center of a light-emitting area of the LED chip and recognizing coordinates of a contour reference point of the LED chip with respect to the recognized center of the light-emitting area, and a light-emitting-element holding mechanism for positioning the LED chip in a bonding position on the board based on the recognized coordinates of the contour reference point. The center of the light-emitting area of the LED chip can be positioned highly accurately in a desired position on the board without being adversely affected by variations in the contour dimensions of the LED chip.