The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Oct. 04, 1995
Applicant:
Inventor:
Kenichi Kurihara, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A semiconductor chip is bonded to lead terminals via insulating layers. The semiconductor chip is electrically connected to the lead terminals in bonding parts on the tip of inner leads by bonding wires, respectively. Indentation having smaller width than that of the bonding parts are provided in the portion where the lead terminal is bonded to the insulating layer. A bent part is provided in the lead terminal is bonded to the insulating layer. Sealing the semiconductor chip, the lead terminals, the insulating films and the bonding wires by resin, a semiconductor device is completed.