Method for manufacturing semiconductor package of center pad type device

Abstract

In accordance with an embodiment of the present invention, a method for manufacturing a semiconductor package of a center pad type device includes: attaching a semiconductor chip to a tape wiring substrate where the chip has bonding pads along a center line of its active surface and the substrate has multiple beam leads; interposing an elastomer between the semiconductor chip and the tape wiring substrate; bonding the beam leads to the respective bonding pads exposed through an opening of the elastomer; and encapsulating the opening and a perimeter of the semiconductor chip with a liquid encapsulant. The method may use a cover film. When the cover film is used, the encapsulation can be done in two ways. In one way, an encapsulant is dispensed on a portion of tape wiring substrate that is close to one end of the opening of the elastomer. The encapsulant is then dispensed along a perimeter of the semiconductor chip. In the other way, the cover film has a number of air vents, and an encapsulant is dispensed at both ends of the opening as well as along the perimeter of the semiconductor chip. In the both ways, the encapsulation may be performed under vacuum. When the cover film is not used, an encapsulant is dispensed in the opening of the elastomer through an opening of the tape wiring substrate. The tape wiring substrate is then turned upside down, and the encapsulant is dispensed along a perimeter of the semiconductor chip.