The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Mar. 30, 1999
Shih Hsiung Lin, Hsinchu, TW;
Hsing Seng Wang, Tau Yuan, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A method for dispensing underfill in a flip chip package formed of an IC chip and a substrate and devices formed by such methods are disclosed. The method for dispensing may be carried out by either a screen printing (or stencil printing) or a dispensing head process wherein droplets of an underfill material may be dispensed on the surface of an IC die or a substrate. Numerous benefits may be achieved by the present invention for dispensing an underfill material which includes shorter cycle time, superior quality product and more flexible processing parameters. The underfill material may be cured in the same reflow furnace during the reflow process for the solder balls such that a separate curing process can be eliminated.