The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Dec. 08, 1999
Jürgen Koch, Mühlheim, DE;
Manfred Koschlig, Aschaffenburg, DE;
Harald Krappitz, Hanau, DE;
Wolfgang Weber, Karlstein, DE;
Klaus Lönne, Burscheid, DE;
Klaus Schmitt, Grünebach, DE;
Other;
Abstract
A process for producing, on a metallic substrate, a geometric metal structure having a precise contour, including the steps of: solder coating a solder paste onto the substrate by screen printing to create the geometric metal structure, the solder paste comprising an organic binder system, and 80 to 95 weight % of a mixture of a nickel-based solder and a pulverulent alloy of nickel with at least one member selected from the group consisting of chromium, molybdenum, tungsten, manganese and iron, provided as a higher-melting metallic filler, wherein a weight ratio of solder to filler is 2-6:1, an average grain size of the solder is between 10 and 50 &mgr;m, and a grain size ratio of solder to filler, relative to the average grain size is from 0.5-2.5:1; drying the structure; decomposing the organic binder system present in the solder paste, without leaving a reside, by a heat treatment; and raising the temperature until the resulting solder material liquifies.