The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Dec. 17, 1998
Applicant:
Inventor:
Yasuhiro Murasawa, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/120 ; H05K 1/14 ;
U.S. Cl.
CPC ...
B32B 3/120 ; H05K 1/14 ;
Abstract
A method for mass producing thin IC cards having beautiful surfaces using a non-polluting polyethylene telephthalate material in which a hot-melt type adhesive is applied and formed on a joint surface of a cover sheet formed from polyethylene telephthalate, and in which a hot-melt adhesive is used as a sealing adhesive at an opening of a core sheet that is held by the cover sheets. To improve the heat-resisting bonding strength of this hot-melt adhesive, a thermosetting resin may be mixed with the hot-melt adhesive.