The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Feb. 03, 1999
Masatoshi Tsuchiya, Tokyo, JP;
Atsushi Mogami, Tokyo, JP;
Yutaka Kobayashi, Tokyo, JP;
Hideki Ohno, Tokuyama, JP;
Masato Sekino, Tokuyama, JP;
Other;
Abstract
A pressure molding apparatus comprises a furnace defining a heating space for accommodating a mold assembly including a mold body charged with a raw material to be molded, and a pressure piston for pressurizing the raw material; heating means for heating the heating space; and load imposing means for imposing a load on the pressure piston to mold the raw material. The load imposing means includes at least one weight means and weight supporting means. The weight supporting means is selectively set in a load-free state in which the weight supporting means supports the weight means so that the weight of the weight means is not imposed on the pressure piston, and a load imposed state in which the weight supporting means releases the support of the weight means so that the weight of the weight means is imposed on the pressure piston.