Mechanism for transferring integrated circuit packages from a source site to a destination site with minimized moving parts

Abstract

A mechanism for transferring an integrated circuit package from a source site to a destination site with use of air to push the integrated circuit package to minimize use of moving parts. The integrated circuit package initially travels through an input passage when the integrated circuit package is placed into an input passage opening at the source site. In addition, an intermediate resting site is disposed at the end of the input passage. The integrated circuit package stops to rest at the intermediate resting site after traveling through the input passage. An output passage has an output passage opening at the intermediate resting site, and the integrated circuit package travels through the output passage to reach the destination site at the end of the output passage. An air nozzle is disposed at the intermediate resting site such that air from the air nozzle is blown onto the integrated circuit package when the integrated circuit package is at the intermediate resting site to push the integrated circuit package into the output passage opening. A detector may determine when the integrated circuit package is at the intermediate resting site such that the air nozzle automatically turns on to blow air onto the integrated circuit package when the detector determines that the integrated circuit passage is at the intermediate resting site.