The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2001

Filed:

Nov. 24, 1998
Applicant:
Inventors:

Daisuke Suzuki, Tokyo, JP;

Kenichi Ono, Tokyo, JP;

Yasuki Morino, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 1/600 ;
U.S. Cl.
CPC ...
C23C 1/600 ;
Abstract

A method of avoiding deposition of particles from a film deposited on a wall of a film deposition apparatus, onto a film deposited in the apparatus, the method including directly heating a wall of a reaction chamber, before placing a wafer on a susceptor in the reaction chamber, to at least a wall film peeling temperature at which a wall film does not peel from the wall; placing a wafer in the reaction chamber, heating the wafer, and depositing a film on the wafer without directly heating the wall; ending heating of the wafer after deposition of the film and directly heating the reaction wall of the reaction chamber to at least the wall film peeling temperature; and removing the wafer from the reaction while the wall of the reaction chamber is maintained at a temperature at least equal to the wall film peeling temperature.


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