The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Sep. 18, 1997
Kiyoshi Imai, Kofu, JP;
Hideaki Watanabe, Kofu, JP;
Hiromi Kinoshita, Singapore, SG;
Dai Yokoyama, Kofu, JP;
Matsushita Electric Industrial Co., Ltd, Osaka-fu, JP;
Abstract
In a method of inserting, into a board, axial-type electronic components, wherein each of the electronic components has a pair of lead wires extending from a main body and belongs to an assembly of electronic components connected by a tape as arranged at regular intervals, the components are grasped with a plurality of chucks which are intermittently moved to a component supplying position and a component transferring position, respectively. Each of these chucks comprises grasping pieces having first and second grasping grooves, the first grasping grooves having inner surfaces for grasping end portions of each of a first kind of the components whose taped portions are of a first tape interval, the second grasping grooves having inner surfaces for grasping end portions of each of a second kind of the components whose taped portions are of a second tape interval smaller than the first tape interval, the second grasping grooves being slightly deeper than the first grasping grooves. The method includes a first process for taking out one of the components from a component supplying device while preventing the second grasping grooves from contacting the lead wires of the component when the lead wires of the component are grasped by the first grasping grooves when the component grasped by the chuck is the first kind of the component, and a component delivering process.