The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Feb. 19, 1999
Applicant:
Inventor:
Kohji Shinomiya, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/192 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/192 ; H01L 2/144 ;
Abstract
A semiconductor integrated circuit device includes a semiconductor substrate having a first surface and including electrodes on the first surface of the semiconductor substrate; a glass coating film covering the first surface of the semiconductor substrate except the electrodes; an external electrode on the electrode in electrical contact with the electrode and having a polished external surface; and a cured resin layer on the glass coating film forming a barrier against intrusion of moisture and ions into the semiconductor substrate, and having the same area as the semiconductor substrate, and a polished external surface.