The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Jun. 24, 1999
Uttam Shyamalindu Ghoshal, Austin, TX (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of fabricating an integrated circuit having air-gaps between interconnect levels. In a preferred embodiment, an integrated circuit is partially fabricated. The partially fabricated integrated circuit includes a top layer, interconnect structures having a cladding layer, dielectric layers and an etch stop layer resistant to certain first types of etchants. The top layer of the integrated circuit is etched with a second type of etchant. The dielectric layers are then etched with one of the first types of etchants until the etch stop layer is reached. Thus, portions of the interconnect structures are exposed to create interconnect islands surrounded by air. A cover is mechanically placed over the exposed interconnect islands to protect the integrated circuit from dust particles.