The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Oct. 16, 1998
Tsuyoshi Kato, Fukushima, JP;
Hirofumi Tateyama, Fukushima, JP;
Hideyuki Ishiyama, Fukushima, JP;
Kiyoshi Suzuki, Fukushima, JP;
Abstract
If the surface of metallic mold should not be highly transcribed to the surface of product in injection molding the plastic products, the transcription defects such as weld, shrinkage, etc. are caused to the surface of product. Further, if the resin should be exposed to the surface of high temperature metallic mold more than necessary during the molding, the filler and the like of glass and so forth are contained into the resin, and in this case, they are left over on the surface of metallic mold, resulting in the transcription defect. These problems can be solved by heating the surface temperature of metallic mold higher than the glass transfer temperature of resin if the resin is non-crystal and higher than the fusion point temperature if the resin crystal, with the temperature raising speed of more than 2° C. every second, maintaining this temperature during the resin charging, and by cooling at the lowering speed of more than 2° C. every second after the completion of charging. This temperature control shall be conducted with the feed back control while detecting the surface temperature of metallic mold by the temperature detection sensor mounted at the position close to the surface of metallic mold.