Enhanced telecommunications cabinet assembly having movable wiring interconnect management tray removably supporting modular interconnect panels

Abstract

An enhanced telecommunications cabinet assembly for enclosing wiring interconnections includes a chassis defining an interior cavity, a movable interconnect management adapter tray positioned in the interior cavity of the chassis, a plurality of modular interconnect panels mounted on the movable adapter tray, and front and top covers on the chassis. The chassis has a bottom wall and a pair of opposite sidewalls extending upward therefrom so as to define the interior cavity between the sidewalls and above the bottom wall. The chassis further has a pair of lower guide members positioning the movable adapter tray in the interior cavity of the chassis for movement relative thereto. The movable adapter tray is capable of undergoing at least one of being lifted upward relative to the bottom wall for removal from the interior cavity of the chassis or being slidably moved forward and backward along the lower guide members on the bottom wall toward and away from front and rear end portions of the bottom wall of the chassis. The front and top covers are provided for enclosing the interior cavity of the chassis respectively at the front and top thereof so as to block access to the front and top of the movable adapter tray and modular interconnect panels thereon. The front and top covers also are movable for exposing the interior cavity at the front and top thereof so as to provide access to the front and top of the movable adapter tray and modular interconnect panels thereon.