The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Jan. 28, 1997
Applicant:
Inventor:
Eric Hertz, Boca Raton, FL (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; B23K 1/00 ;
U.S. Cl.
CPC ...
B23K 3/102 ; B23K 1/00 ;
Abstract
A method and apparatus are disclosed for placing solder balls,on electronic pads,on a substrate,such as for a ball grid array (BGA) applicator,The solder balls,are held to openings,in a foil,such as by vacuum force,applied to the solder balls,through the openings,in a foil,After locating the solder balls,at electronic pads,on a substrate,by deactivating the vacuum force,and optionally applying a release force,the solder balls,are released and placed on the electronic pads,Optionally, a release mechanism,applies placing force,to the solder balls,through the openings,in the foil