The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Jun. 14, 1999
Applicant:
Inventors:
Assignee:
Hitachi Metals, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 ;
U.S. Cl.
CPC ...
G11B 5/127 ;
Abstract
A manufacturing method that can manufacture small thin film magnetic head sliders with high dimensional accuracy and high manufacturing yield is disclosed. This manufacturing method uses 5 inch- or 6 inch-dia. substrate wafers having a thickness sufficient to keep wafer bending to a minimum level even after thin film magnetic head elements have been formed on it. On the front side surface of the substrate wafer formed are thin film magnetic elements. After a protective layer covered on the surface of the thin film magnetic head elements has been ground and/or lapped, the back side surface of the substrate wafer is ground and/or lapped to a thickness equal to a desired slider length.