The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2001

Filed:

Feb. 16, 1999
Applicant:
Inventor:

Kevin A. McCullough, Warwick, RI (US);

Assignee:

Chip Coolers, Inc., Warwick, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A heat sink assembly, having a number of mounting holes therethrough, is installed on a heat generating surface of an electronic component for removing heat therefrom. A heat dissipating member having a base portion having a bottom surface and an upper surface with heat dissipating elements connected thereto is provided. The bottom surface is adapted to be matable in flush thermal communication with a heat generating surface of an electronic component. A cam assembly includes a support body as well as a connection body that is pivotally connected thereto about a pivot axis. At least one leg is connected to the support body with a retention member on its free end. The leg is routed through a selected one of the base apertures and one of the mounting holes corresponding thereto. The connection body is rotated about the pivot axis to provide a camming action against the top surface of the base portion of the heat dissipating member to maintain the heat dissipating member in flush thermal communication with the heat generating surface of the electronic component. The retention member on the leg prevents the leg from being removed from the apertures in which is resides thus maintaining the connection body in communication with the top of the base of the heat dissipating member.


Find Patent Forward Citations

Loading…