The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2001

Filed:

Dec. 16, 1998
Applicant:
Inventors:

Jan H. Mooij, Roermond, NL;

Henricus H.M. Wagemans, Roermond, NL;

Joghum P. Venema, Roermond, NL;

Assignee:

U.S. Philips Corporation, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 ; H01C 1/012 ;
U.S. Cl.
CPC ...
H01G 4/228 ; H01C 1/012 ;
Abstract

A thin-film component, for example a capacitor, a resistor and a coil, as well as combinations thereof. A substrate of an electrically insulating material (preferably glass), is provided with two U-shaped side contacts and with an electrical structure which is electrically connected to both side contacts. A flexible layer (preferably polyimide) is situated between the substrate and at least one of both legs of each of the U-shaped side contacts, which flexible layer is provided directly on the substrate surface, and in that the modules of elasticity of the material of the layer is below 50 GPa. By virtue of this measure, it is achieved that the components demonstrate a better resistance to standard bending tests. As a result, the product-failure percentage is reduced if these components are employed in flexible PCBs or in PCBs which are subjected to a vibration.


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