The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Jun. 08, 1998
Applicant:
Inventors:
Tomoko Honda, Kanagawa-ken, JP;
Masaki Adachi, Kanagawa-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/329 ;
U.S. Cl.
CPC ...
H01L 2/329 ;
Abstract
A reusable packaging material for semiconductor devices. The semiconductor device package is formed from a thermoplastic resin. The resin has good fluidity and good adhesion. The new package is recyclable because the thermoplastic resin hardening process is reversible. The new package has sufficient mechanical strength and adhesion to seal a semiconductor device. A thermoplastic material for sealing a semiconductor element is characterized by 4.5×10,[1/.degree.C.] or less linear thermal expansivity at about 150-200 .degree.C.