The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Jun. 22, 1999
Yoshitake Terashi, Kagoshima, JP;
Shinya Kawai, Kagoshima, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
Ceramics for wiring boards having an SiO,crystal phase, a spinel type oxide crystal phase containing Mg or Zn and Al and a composite oxide type crystal phase containing at least Sr, Al and Si, and having a coefficient of thermal expansion of not smaller than 5.5 ppm/° C. at room temperature through up to 400° C., a dielectric constant of not larger than 7, and a dielectric loss of not larger than 50×10,at 20 to 30 GHz. The ceramics can be obtained by the co-firing with a low-resistance metal such as copper or silver, and can be advantageously applied for the production of a wiring board for treating, particularly, signals of high frequencies. Furthermore, the ceramics has a coefficient of thermal expansion which is so large as can be brought close to the coefficient of thermal expansion of the semiconductor element such as GaAs or of the printed board. Therefore, the wiring board produced by using the ceramics makes it possible to effectively prevent the mounting portions from being damaged by the difference in the thermal expansion.