The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Aug. 24, 1998
Applicant:
Inventors:
Tzyy-Jang Tseng, Hsinchu, TW;
David C. H. Cheng, Taoyuan Hsien, TW;
Shaw-Wen Lao, Hsinchu Hsien, TW;
Assignee:
World Wiser Electronics Inc., Taoyuan Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 ; H05K 7/20 ; H01L 2/334 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H05K 3/34 ; H05K 7/20 ; H01L 2/334 ; H01L 2/348 ;
Abstract
A printed circuit board thermal conductive structure comprises a thermal spreader layer having an embossed pattern formed on its surface, an adhesive glue layer formed over the thermal spreader, and a surface metallic layer attached to the thermal spreader and the glue layer. A portion of the surface metallic layer is in direct contact or almost direct contact with the thermal spreader. Furthermore, an additional external heat sink can be attached to thermal conductive structure to increase the efficiency of heat dissipation.