The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Dec. 29, 1999
Hitoshi Iwata, Aichi-ken, JP;
Masakata Kanbe, Aichi-ken, JP;
Kabushiki Kaisha Tokai Rika Denki Seisakusho, Aichi-ken, JP;
Abstract
An acceleration sensor with a diaphragm sensor chip has lead frames. One of the lead frames has a die pad. The sensor chip is flexibly adhered to the die pad by adhesive. The sensor chip has a diaphragm. The sensor chip outputs signals in accordance with flexure of the diaphragm. The lead frames are molded by a mold member. The mold member define a space about the sensor chip. The coefficient of linear expansion of the mold member is between 1.4×10,/° C. and 1.8×10,/° C., and the modulus of elasticity of the mold member is between 100×10,kg/cm,and 130×10,kg/cm,. Use of the mold member minimizes the ratio of change of sensitivity due to temperature changes, which improves the temperature characteristics of the sensor.