The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2001

Filed:

Jun. 29, 1998
Applicant:
Inventors:

Dwight L. Daniels, Mesa, AZ (US);

Jeffrey A. Miks, Chandler, AZ (US);

Dilip Patel, Mesa, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract

An electronic component assembly (,) is formed by mounting an electronic component (,) to the leads (,) of a leadframe (,). The portions of the leadframe (,) that come in physical contact with the electronic component (,) are electrically connected to the electronic component with bonding wires (,) or by placing the bonding regions (,) of the electronic component (,) in direct physical contact with the tips (,) of the leads (,). A package (,) is used to encapsulate the leads (,) and the electronic component (,).


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