The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Jun. 15, 1999
Applicant:
Inventors:
Satoshi Ito, Osaka, JP;
Makoto Kuwamura, Osaka, JP;
Masaki Mizutani, Osaka, JP;
Hiroshi Noro, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
Described is a process for the fabrication of a semiconductor device, which comprises a step of simultaneously or successively mounting at least one semiconductor element having a connecting electrode portion onto each of both sides of an interconnection circuit substrate through an encapsulating resin layer and a step of connecting said at least one semiconductor element with an interconnection electrode on each of both sides of said interconnection circuit substrate by making use of the adhesive force of said encapsulating resin layer.