The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Apr. 13, 1999
Applicant:
Inventors:
Tomoyasu Imai, Kariya, JP;
Hiroaki Asano, Okazaki, JP;
Hayashi Kodama, Handa, JP;
Masato Kitajima, Hekinan, JP;
Masashi Yanagisawa, Okazaki, JP;
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/00 ; B24D 1/700 ; B24D 1/800 ; B24D 3/06 ; B24D 3/10 ;
U.S. Cl.
CPC ...
B24D 3/00 ; B24D 1/700 ; B24D 1/800 ; B24D 3/06 ; B24D 3/10 ;
Abstract
An abrasive tool includes an electroformed layer having superabrasive grains electroplated on an outer surface of the electroformed layer, and a plurality of dimples arranged on the outer surface of the electroformed layer using a mold with projections made of gel adhesive. The concentration of the abrasive gains is regulated by changing the number of the dimples (i.e., changing a dimple-area-rate). The gel adhesive preferably has a viscosity of 500,000 cP or smaller. The dimple-area-rate is preferably from 7 to 70%.