The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2001
Filed:
May. 17, 1999
Applicant:
Inventor:
Andrew J. Black, San Antonio, TX (US);
Assignee:
VLSI Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 2/726 ;
U.S. Cl.
CPC ...
G01R 2/726 ;
Abstract
Thickness of a wafer is monitored during grinding. A conductive plate is located below the wafer during grinding. One or more capacitive sensors are located above the wafer during grinding. A monitoring device monitors capacitance of the conductive plate and the capacitive sensor.