The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2001
Filed:
Jul. 01, 1999
John Michael Coronati, Mountaintop, PA (US);
Intersil Corporation, Palm Bay, FL (US);
Abstract
A package for mounting a power semiconductor device to a printed circuit board comprises a dielectric ceramic plate having an upper and lower surface and a grid array of holes penetrating the plate. A plurality of conductive metal contact pads that provide electrical contact for the power semiconductor device are disposed on the upper surface of the ceramic plate, and a conductive metal fills the holes. The metal-filled holes are connected to the conductive metal contact pads and provide vias from the pads to the lower surface of the ceramic plate. An array of solder balls, each ball being attached to a via at the lower surface of the ceramic plate, provide connection terminals to the printed circuit board. Sidewalls are sealably connected to the ceramic plate at its perimeter, and a lid is sealably connected to the sidewalls. The lid comprises, together with the sidewalls and ceramic plate, a hermetically sealed cavity that encloses the power semiconductor device and conductive metal contact pads.