Method and apparatus for aligning an integrated circuit chip

Abstract

A three point alignment feature facilitates alignment of an integrated circuit chip relative to a socket that is mounted on a printed circuit board,. The socket includes four walls that define a rectangle in which the integrated circuit chip is mounted. A first contact point,extends inward from a first one,of the walls. Second and third contact points,extend inward from a second one,of the walls. A first force is applied against the integrated circuit chip from a third one,of the walls. Second and third forces are applied against the integrated circuit chip from a fourth one,of the walls. Hence, the integrated circuit chip is aligned in a corner defined by the first and second walls, and is oriented by the three contact points. Spring members,may be employed to provide the first, second and third forces. Another alignment feature including two posts,on the socket is employed to facilitate alignment of the socket with respect to the printed circuit board. The socket is rotatable about the first post,when inserted in a corresponding hole in the circuit board; insertion of the second post,into its corresponding hole prevents further rotation of the socket. Further, captive hardware fasteners may be employed to attach the socket to the printed circuit board.