The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2001
Filed:
May. 28, 1999
Mold-Masters Limited, Georgetown, CA;
Abstract
A seepage system for an injection molding apparatus includes a manifold plate with a first portion and a second portion abutting the first portion, and a seepage passage positioned between the first and second portions. The second portion may have at least a portion of a melt passage, and the seepage passage may have an outlet. The seepage system also has one or more seepage channels, with each seepage channel being connected to and in communication with the seepage passage. Moreover, the seepage system includes one or more seepage bores for receiving the flow of excess material, with each seepage bore being connected to and in communication with one of the seepage channels. Gravity is used to assist the flow of excess material from the one or more seepage bores through the seepage channels and the seepage passage.