The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2001
Filed:
Jun. 24, 1999
Robert Newman, Santa Clara, CA (US);
Chu-Chung Lee, Santa Clara, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A package for housing a device (e.g., an integrated circuit chip or die) is disclosed including a ball grid array substrate and a thermoelectric cooler (e.g., a Peltier effect device). The thermoelectric cooler is housed within the package. The thermoelectric cooler is coupled to the ball grid array substrate and includes a hotter portion and a cooler portion in response to an electric potential difference. The thermoelectric cooler receives the electric potential difference from the package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile