The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Feb. 13, 1998
Logan Lloyd Simpson, Austin, TX (US);
Cindy Reidsema Simpson, Austin, TX (US);
Joseph Edward Varsik, Binghamton, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for selectively metallizing one or more through-holes, other openings (such as slots), or edges of an electronic circuit package comprising the steps of forming a layer of seeding solution on a drilled surface of a substrate of interest exposing this layer to light of appropriate wavelength, through a mask that does not completely cover the through-holes or openings and thereby results in the formation of metal seed on regions of the substrate surface corresponding to the regions of the layer of seeding solution exposed to light; removing the unexposed regions of the layer of seeding solution by subjecting the exposed and unexposed regions of the layer of seeding solution to an alkaline solution. Thereafter, additional metal is deposited, e.g., plated, onto the metal seed using conventional techniques. Significantly, this method does not involve the use of a photoresist, or of a corresponding chemical developer or photoresist stripper. Of additional significance, this method yields plated through-holes or other openings, each of which can accommodate multiple wires, rather then the traditional one wire per through-hole.