The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Jun. 06, 1994
Toshimitsu Ishikawa, Yokohama, JP;
Kazuichi Komenaka, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
There is disclosed a plastic mold type semiconductor device comprising: a semiconductor chip, leads each having one end portion positioned outside the semiconductor chip in a manner spaced therefrom and the other end portion extending to the portion above the semiconductor chip, and bonding wires for connecting the semiconductor element and the leads, each of the leads being provided with a bonding portion positioned outside of the semiconductor chip. Even if the size of the semiconductor chip and that of the envelope are extremely close to each other, the lead has sufficient length within the molded plastic material so that the lead may not be pulled out.