The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2001

Filed:

Oct. 05, 1998
Applicant:
Inventors:

Masanobu Fujii, Shimodate, JP;

Haruaki Sue, Tsukuba, JP;

Shinya Yamada, Tochigi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 ; C08L 6/300 ; C08L 6/302 ; C08L 6/304 ;
U.S. Cl.
CPC ...
C08K 3/36 ; C08L 6/300 ; C08L 6/302 ; C08L 6/304 ;
Abstract

An epoxy resin composition comprises (A) a biphenyl epoxy resin, (B) a phenolic resin curing agent having a naphthalene structure, (C) a curing accelerator comprising an addition product of a triphenylphosphine and benzoquinone, and (D) an inorganic filler contained in an amount of 85 to 95% by weight based on the total amount of the composition, and a semiconductor device encapsulated by this resin composition.


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