The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Aug. 25, 1999
David Joseph Anderson, Oak Lawn, IL (US);
John Thomas Meagher, Hawthorn Woods, IL (US);
Motorola Inc., Schaumburg, IL (US);
Abstract
A process for fabricating an electronic module (,) and a packaged electronic device (,) having a thermally conductive substrate includes the step of thermally spraying of a dielectric layer (,) onto a baseplate (,). An electrically conductive layer (,) is then direct bonded to the thermally sprayed dielectric layer. The thermally sprayed dielectric layer can be formed at selected locations on the upper surface of the baseplate (,) by forming a pattern on the upper surface prior to carrying out the thermal spraying process. The electrically conductive layer (,) is patterned to form an interconnect pattern overlying the baseplate. Because the thermal spraying process can form extremely thin dielectric layers, an electronic module (,) fabricated in accordance with the invention exhibits high heat transfer characteristics. A heat producing electronic component (,), such as a power transistor, can be attached to the electrically conductive layer (,), and the heat generated therefrom dissipated through the baseplate (,).