The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Mar. 31, 1999
Nagano Keiki Co. Ltd., Tokyo, JP;
Abstract
In a pressure sensor chip (,), an extension (,) is provided on a lower glass (,) and a signal receiving portion (,) of a conductive layer is formed from a surface (,A) of an extension (,) to an upper surface (,B) of an upper glass (,). Accordingly, the signal receiving portion (,) does not touch a circuit substrate when the pressure sensor chip (,) is mounted to the circuit substrate and the like, thereby preventing electric failure such as noise pickup of the signal receiving portion (,). Further, since the signal receiving portion (,) is formed by the conductive layer, no particular space for receiving electric potential from a diaphragm is necessary, thereby enabling size reduction of the pressure sensor chip (,). Since an anodic-bonding electrode (,) is disposed on a border (,) and is cut and removed in separating as the pressure sensor chip (,), visual check is not obstructed and contamination by being peeled-off can be prevented.