The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2001
Filed:
May. 06, 1999
Applicant:
Inventor:
Mike C. Loo, San Jose, CA (US);
Assignee:
Philips Electronics North America Corporation, New York, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
Thin organic layers are laminated on both the top and bottom of a relatively thin ceramic layer to form a reliable thinner composite substrate for packaging a chip-scale flip-chip die in a thin package. A semiconductor die has a number of solder bump-mounting pads formed thereupon which are connected with solder bumps to mounting pads on the top surface of the thin composite substrate.