The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2001
Filed:
Mar. 29, 1999
Zowie Technology Corporation, Taipei, TW;
Abstract
This invention is directed to a semiconductor rectifier chip comprised of a semiconductor dice with at least one P-N junction, and the entire cutting surface of the dice sealed a passivation glass to omite the use of a expansion plate. The rectifier chip is made of negative or positive silicon semiconductor wafer that has been subjected to standard wafer diffusion process to form P,-N-N,or N,-P-P,layer construction, then to cut into a plurality of dices which having a cutting surface, the cutting surface from N,to P,of the dice is sealing by the passivation glass to omite the use of the expansion plate, and the electrode ohmic contact metal for soft soldering or hard brazing purpose is made on both sides of the dice simultaneously.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile